IBM unveils water-cooled 3D chip prototype
IBM on Thursday announced plans to use water to cool its next-generation of computer chips internally, allowing it to develop faster multi-layer processors that don’t require additional external cooling. To this end, the company showed off a prototype 3D chip with thousands of tiny water passages in between the chip’s layers. The company says interlayer cooling was necessary, as traditional heat sinks weren’t efficient enough to cool today’s densely packaged processors. The water-carrying tubes are just 50 microns in diameter, and integrating them into the chip necessitated the development of a new thin-film soldering technique by IBM engineers.
Read more: electronista.com
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